Special Issue on Welding and Soldering Materials: Global Approach in Joining

Submission Deadline: Apr. 30, 2020

This special issue currently is open for paper submission and guest editor application.

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Special Issue Flyer (PDF)

  • Special Issue Editor
    • Jayesh S
      Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kerala, India
    Guest Editors play a significant role in a special issue. They maintain the quality of published research and enhance the special issue’s impact. If you would like to be a Guest Editor or recommend a colleague as a Guest Editor of this special issue, please Click here to fulfill the Guest Editor application.
    • Ajin Sajeevan
      Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kerala, India
    • Asif S
      Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kerala, India
    • Nithin M Joy
      Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kerala, India
    • Unnikrishnan M M
      Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kerala, India
    • Anoop A M
      Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kerala, India
    • Jinu Mathew
      Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kerala, India
  • Introduction

    Metal has been worked by humans for thousands of years. Over time, the techniques and technology used to produce and shape metal goods have been driven by the innovations of science and technology. Metal welding is the fusing of two pieces of metal to create one solid continuous piece. All welders work on the same principle. The need for light materials is increasing around the world to meet the material demands. The researches in the welding material are therefore very vital. The introduction of such materials can change the scenario. The lead is banned in the alloy making citing its inherent toxicity. Therefore Sn-Pb alloy cannot be used anymore. Many lead free solder alloys came to replace the Sn-Pb alloy. But still they were not able to be a leader in the joining area in all aspects. It is a challenging task for researchers to find new lead free solder alloy.
    This special issue aims at getting vital and accurate studies related to welding material and lead free solder alloys with enhanced properties.

    Aims and Scope:

    1. To find new light weight welding material
    2. To publish detailed reviews about welding materials
    3. To find new procedures which enhances the efficiency
    4. To find new lead free solder alloys
    5. To publish reviews in lead free solder alloys
    6. To find new efficient electronic materials for joining

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.ijmsa.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.

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